Semiconductor

In the semiconductor industry, where precision, reliability and contamination control are paramount, FFKM materials play a crucial role.

FFKM materials are known for their exceptional resistance to extreme temperatures, harsh chemicals and aggressive plasma environments, making them ideal for use in critical semiconductor manufacturing processes. From sealing application in semiconductor equipment to wafer handing, FFKM materials offer unmatched performance, ensuring integrity of processes and minimizing downtime due to material failure.

Sealing solutions show key qualities such as low plasma erosion rates, high temperature stability, excellent resistance to various chemical processes (dry and wet), and exceptional sealing performance. Additionally, to maintain product purity, all FFKM seals are manufactured and packaged in a cleanroom environment.

We manufacture sealing solutions for:

  • Lithography machines
  • Wafer handling machines
  • Wafer surface treatment machines
  • Chip process machines
  • Vacuum machines
Compounds for Semiconductor applications

  • Plasma process

    To withstand aggressive plasma conditions, seals need to have high purity, low particle generation and low outgassing to guarantee reliability and long-life.

  • Thermal process

    Thermal based applications require high-performance materials to give long term sealing resistance at high temperatures, together with specific chemical resistance.

  • Wet chemical process

    Wet chemistry is widely used in the processing of wafers, requiring high resistance to specific chemicals, without contributing to organic or metallic contamination of the stripping or cleaning fluids.

Our Clean room

Everywhere you go, we go with you.

Materials

The following materials are the most commonly used

  • FFKM, evolast®

    Characterised by a broad service temperature range from -46 °C to 340 °C, evolast® compounds exhibit remarkable resistance to aggressive chemicals, such as acids, organic and inorganic fluids, ketones, esters, solvents, amines, as well as hot water and steam.

  • FKM

    Special compounds for explosive decompression (AED/RGD) ensure reliable performance in extreme conditions. Working within temperature ranges from -60 °C to 250 °C, these materials exhibit good physical properties and excellent chemical resistance.

Do you want to know more?

Don't hesitate to contact us for any further request.

Contact us